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TDA2822 march 1995 dual power amplifier . supply voltage down to 3 v . low crossover distorsion . low quiescent current . bridge or stereo configuration description the TDA2822 is a monolithic integrated circuit in 12+2+2 powerdip, intended for use as dual audio power amplifier in portable radios and ts sets. powerdip (plastic 12+2+2) ordering number : TDA2822 typical application circuit (stereo) 1/11
schematic diagram absolute maximum ratings symbol parameter value unit v s supply voltage 15 v i o output peak current 1.5 a p tot total power dissipation at t amb = 50 c at t case = 70 c 1.25 4 w w t stg , t j storage and junction temperature C 40 to 150 c pin connection (top view) TDA2822 2/11
thermal data symbol parameter value unit r th j-amb r th j-case thermal resistance junction-ambient thermal resistance junction-pins max max 80 20 c/w c/w electrical characteristics (vs = 6 v, t amb = 25 c, unless otherwise specified) stereo (test circuit of fig. 1) symbol parameter test condition min. typ. max. unit v s supply voltage 3 15 v v c quiescent output voltage v s = 9 v v s = 6 v 4 2.7 v v i d quiescent drain current 6 12 ma i b input bias current 100 na p o output power (each channel) d = 10 % f = 1 khz v s = 9 v r l = 4 w v s = 6 v r l = 4 w v s = 4.5 v r l = 4 w 1.3 0.45 1.7 0.65 0.32 w w w g v closed loop voltage gain f = 1 khz 36 39 41 db r i input resistance f = 1 khz 100 k w e n total input noise r s = 10 k w b = 22 hz to 22 khz curve a 2.5 2 m v m v svr supply voltage rejection f = 100 hz 24 30 db cs channel separation r g = 10 k w f = 1 khz 50 db bridge (test circuit of fig. 2) v s supply voltage 3 15 v i d quiescent drain current r l = 612ma v os output offset voltage r l = 8 w 10 60 mv i b input bias current 100 na p o output power d = 10 % f = 1 khz v s = 9 v r l = 8 w v s = 6 v r l = 8 w v s = 4.5 v r l = 4 w 2.7 0.9 3.2 1.35 1 w w w d distortion (f = 1 khz) r l = 8 w p o = 0.5 w 0.2 % g v closed loop voltage gain f = 1 khz 39 db r i input resistance f = 1 khz 100 k w e n total input noise r s = 10 k w b = 22 hz to 22 khz curve a 3 2.5 m v m v svr supply voltage rejection f = 100 hz 40 db TDA2822 3/11
figure 1 : test circuit (stereo). figure 2 : p.c. board and components layout of the circuit of figure 1 (1:1 scale). TDA2822 4/11
figure 3 : test circuit (bridge). figure 4 : p.c. board and components layout of the circuit of figure 3 (1:1 scale). TDA2822 5/11
figure 5 : output power vs. supply voltage (stereo). figure 6 : output power vs. supply voltage (bridge). figure 7 : distorsion vs. output power (bridge). figure 8 : distorsion vs. output power (bridge). figure 9 : supply voltage rejection vs. frequency. figure 10 : quiescent current vs. supply voltage. TDA2822 6/11
figure 11 : total power dissipation vs. output power (stereo). figure 12 : total power dissipation vs. output power (bridge). figure 13 : total power dissipation vs. output power (bridge). TDA2822 7/11
figure 14 : application circuit for portable radios. mounting instruction the r th j-amb of the TDA2822 can be reduced by sol- dering the gnd pins to a suitable copper area of the printed circuit board (figure 15) or to an external heatsink (figure 16). the diagram of figure 17 shows the maximum dis- sipable power p tot and the r th j-amb as a function of the side " ? " of two equal square copper areas having a thickness of 35 m (1.4 mils). during soldering the pins temperature must not ex- ceed 260 c and the soldering time must not be longer than 12 seconds. the external heatsink or printed circuit copper area must be connected to electrical ground. figure 15 : example of p.c. board copper area which is used as heatsink. figure 16 : external heatsink mounting example. TDA2822 8/11
figure 6 : maximum dissipable power and junction to ambient thermal resistance vs. side " ? ". figure 7 : maximum allowable power dissipation vs. ambient temperature. TDA2822 9/11
powerdip 16 package mechanical data dim. mm inch min. typ. max. min. typ. max. a1 0.51 0.020 b 0.85 1.40 0.033 0.055 b 0.50 0.020 b1 0.38 0.50 0.015 0.020 d 20.0 0.787 e 8.80 0.346 e 2.54 0.100 e3 17.78 0.700 f 7.10 0.280 i 5.10 0.201 l 3.30 0.130 z 1.27 0.050 TDA2822 10/11
information furnished is believed to be accurate and reliable. however, sgs-thomson microelectronics assumes no responsibility for the consequences of use of such information nor for any inf ringement of patents or other rights of third part ies which may result from its use. no license is granted by impl ication or otherwise under any pat ent or patent rights of sgs-thomson microelectronics. specifica- tions mentioned in t his publication are subject to change without noti ce. this publication supersedes and replaces all information pre- viously supplied. sgs-thomson microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of sgs-thomson microelec tronics. ? 1995 sgs-thomson microelectronics - all rights reserved sgs-thomson microelectronics group of companies aust ralia - brazil - france - germany - hong kong - i taly - j apan - korea - malaysia - malta - morocco - the netherlands - sin gapore - spain - sweden - switzerland - taiwan - thaliand - united k ingdom - u.s.a. TDA2822 11/11

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